In terms of smarter development, the footsteps of the major manufacturers of TWS have never stopped. Investing in heavy research and development, leading new technologies, creating differentiation, developing new tracks, the technology supply chain is becoming more and more mature, and product updates are iterating faster and faster.
Golden nine and silver ten, in the TWS summit hosted by Sunrise Big Data on September 3, there will be nearly 50 on-site exhibitors with new products that are completely different from the previous debut, and TWS will also show more possibilities in the future with a brand new look.
As of 7.26.2021, there are 32 products on the Graphic Supply Chain list.
As the main control "brain" of TWS true wireless Bluetooth headset, the main control chip carries Bluetooth transmission, noise cancellation, RF, CODEC and many other functions, which is an indispensable and important part of TWS headset, and is also the segment that accounts for the largest share of TWS headset. In the data gentleman and industry chain professionals to communicate, understand that at present in the field of TWS, with the development and design of Bluetooth master control chip manufacturers involved in hundreds of data gentleman through the illustration of the supply chain is also sorted out seven excellent master control chip suppliers, let us explore together, Bluetooth master control chip of the wonderful world!
TWS Supply Chain - Master Chip Providers
In which BES Hengxuan appeared in the supply chain as many as 18 times, Qualcomm Qualcomm and Airoha Lodging appeared 5 times, APPLE Apple/Airoha Lodging appeared 5 times, APPLE Apple/Airoha Lodging appeared 5 times, APPLE Apple/Airoha Lodging appeared 5 times, APPLE Apple/Airoha Lodging appeared 5 times. 5 times, APPLE Apple/Actions Torchcore/Hisilicon Huawei Hesi/RealTek Renesas appeared in 1 time.
Hengxuan Technology
Hengxuan Technology is mainly engaged in the research and development, design and sales of smart audio SoC chips, to provide customers with AIoT scenarios with voice interaction capabilities of the edge of the intelligent master control platform chip, the product is widely used in smart Bluetooth headset, Type-C headphones, smart speakers and other smart terminal products. Hengxuan Technology is committed to be the world's largest and most advanced technology provider. Hengxuan Technology is committed to become the most innovative chip design company in the world, with forward-looking R&D and patent layout, continuous technology accumulation, rapid product iteration, flexible customer service, and constantly launching leading-edge products and solutions, to become the leader of AIoT master control platform chip.
Qualcomm
Qualcomm (English name: Qualcomm, Chinese abbreviation: Qualcomm Incorporated, Qualcomm Incorporated, or Qualcomm Incorporated in the United States) was founded in 1985, Qualcomm is the world's leading innovator of wireless technology, transforming the way the world connects, computes and communicates. Connecting cell phones to the Internet, Qualcomm's invention ushered in the era of mobile connectivity. Qualcomm has been doing business in China for more than 20 years, and its collaboration with Chinese ecosystem partners has expanded to include smartphones, integrated circuits, the Internet of Things, big data, software, automotive and many other industries.
Airoha Technologies
Airoha Technologies, founded in 2001, is an industry-leading IC design leader with a decade of experience in developing highly integrated circuits for wireless communications, providing customers with high-performance, low-cost, mixed-signal RF and mixed-signal IC components and Bluetooth? wireless chips. In the second decade, the company invested in Bluetooth low-power single chip and Bluetooth wireless audio system solutions. After becoming a member of the MediaTek group of companies in 2017, the company further combined the group's strengths to cross over to the field of Internet of Things (IoT), providing low-power microprocessor system-on-chip (SoC) with various types of wireless communication technologies, connecting billions of smart devices in the future Internet of Things (IoT) world.
Apple
Apple Inc. is a U.S. multinational corporation headquartered in Cupertino, California that designs, develops, and markets consumer electronics, computer software, online services, and personal computers. Its best-known computer hardware products include the Mac series, iPod media players, iPhone smartphones, and iPad tablets. Online services include iCloud, iTunes, and the AppStore. Its consumer software includes the OSX and iOS operating systems, the iTunes Media Browser, the Safari browser, iLife, and iWork.
Torchcore Technology
Torchcore Technology Co. Ltd. specializes in the research, development, design and sales of mid-range and high-end smart audio SoC chips.
Torchcore's main products are Bluetooth audio SoC chip series, portable audio and video SoC chip series, intelligent voice interaction SoC chip series, etc., which are widely used in the fields of Bluetooth speaker, Bluetooth headset, Bluetooth voice remote control, Bluetooth transceiver, smart education, smart office, smart home and so on. The company is y committed to the audio codec, analog-digital hybrid multimedia processing, power management and high-speed analog interface as the core of the low-noise, low-power, high-quality audio signal chain technology. As well as Bluetooth RF, baseband and protocol stack technology as the core of the low-power wireless connection technology. The company specializes in providing high-quality audio on the basis of low power consumption, and specializes in integrating RF communication, power management, mixed analog-digital audio signal processing, CPU, DSP, and storage unit and other modules on a single chip SoC; at the same time, it enhances the value of the SoC through the integration of software development kits and core algorithms, and helps customers to reduce the threshold of chip-based development and mass production. In the face of a large number of fields, terminal development ability varies greatly in the customer base, the company can provide a total solution as well as convenient secondary development of hardware and software development platform.
Huawei Haisi
Haisi Semiconductor is a semiconductor company, Haisi Semiconductor Co., Ltd. was founded in October 2004, the predecessor of Huawei Integrated Circuit Design Center, which was founded in 1991. Headquartered in Shenzhen, Hath has design branches in Beijing, Shanghai, Silicon Valley and Sweden. Hath's products cover chips and solutions in wireless networks, fixed networks, digital media, etc., which are successfully applied in more than 100 countries and regions around the world; in the field of digital media, it has launched SoC network monitoring chips and solutions, video phone chips and solutions, DVB chips and solutions, and IPTV chips and solutions.Hath's Q1 revenue in 2019 amounted to 1.755 billion dollars, a year-on-year jump of 41%, the growth rate is much higher than other semiconductor companies, and the ranking has risen to the 14th place.
Renesas Semiconductor
Renesas Semiconductor was founded in 1987, is located in the Hsinchu Science Park in Taiwan, China's "Silicon Valley," known as the year the enthusiasm and perseverance of a number of young engineers, through the arduous start-up period To today's world-leading professional IC design company, Rexchip Semiconductor through thick and thin, showing strong ambition and excellent competitiveness, to develop high-performance, high-quality and cost-effective IC solutions that are widely recognized and welcomed by the global market. Renesas Semiconductor's steady growth since its inception is attributed to Renesas' dedication to product/technology development and innovation, as well as to Renesas' tradition of excellence.
How big is the TWS headset market?
According to Sunrise Big Data statistics, 460 million pairs of TWS were shipped globally in 2020, a year-on-year increase of 43.75%. Global shipments are expected to continue to rise in 2021.
Among them, brands accounted for 44%, and the market share held by white brands was 56%. Compared to 2019, it is easy to find that the brand share is steadily increasing, and the white brand market share is further narrowed, but still occupies the main market.
What is certain is that the development of the TWS market has ushered in a brand new wind mouth, and shipments are expected to exceed the one billion mark.
TWS MasterCard Market Trends
A Bluetooth technology change, optimize the user experience of TWS headset
In January 2020, BluetoothSpecial Interest Group, or SIG, officially launched the new Bluetooth headset. Interest Group (SIG) officially released a new generation of Bluetooth audio technology standard - BluetoothLE Audio (low-power Bluetooth audio, hereinafter referred to as BLEAudio), which means that the low-power Bluetooth technology standard will support audio transmission function.BLEAudio BLEAudio has the advantages of low power consumption, wide connection range, and low cost of single-mode Bluetooth chip, so Sunrise believes that single-mode low-power Bluetooth is expected to replace the traditional Bluetooth in the future, in other words, mobile electronic devices only need to use a single-mode low-power Bluetooth chip.
BLEAudio has three main technical features
1: LowComplexity Communication Codec (LC3)
2: Multi-StreamAudio (Multi-StreamAudio)
3: Broadcast Audio Sharing (AudioSharing)
2. TWS MasterChip "Promotion"
SiP (SysteminPackage) is a packaging concept that combines all or most of the electronic functions of a system or a subsystem into a single package. SiP (SysteminPackage) is a packaging concept where all or most of the electronic functions of a system or subsystem are configured in an integrated substrate, and the chips are bonded to the integrated substrate in a 2D or 3D manner.SiP can be assembled not only with multiple chips, but also as a specialized processor, DRAM, flash memory and passive components combined with resistors and capacitors, connectors, antennas, etc., all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package so that a small number of external components need to be added to make it work.
Industry Summary
The hot market for TWS headphones has allowed several chip makers to compete on Bluetooth audio SoCs, and continue to launch a variety of Bluetooth true wireless solutions. The big brands that have the ability to develop their own chips tend to use their own chips in order to get the best optimization for their own products. Compared to the blossoming of TWS brand vendors, the head-to-head concentration of chip vendors is more pronounced, with each vendor having a differentiated target market. However, we believe that as the TWS industry develops, this clear pattern of polarization will eventually be broken, and the head-to-head vendors of excellence will be able to expand their product lines more and cover more markets.